There are two processes that provide important benefits to a number of manufacturing facilities - the megasonic and the ultrasonic cleaning. These two systems have been useful particularly to the sectors that manufacture products like integrated circuit (used in electronic products), raw silicon , mask, hard drives, flat panel display, and other products that require stringent cleanliness.
Megasonic versus Ultrasonic
The question you might have in mind right now is "how does megasonic cleaning differ from ultrasonic cleaning?" While these two processes are serving the same industries, they differ in a number of ways and here are some of the most important distinctions:
- They vary in terms of frequency used in generating acoustic waves; megasonic cleaning utilizes higher frequencies at 100kHz ; ultrasonic cleaning uses lower frequencies
- Another distinction is seen in cavitation; megasonic produces controlled cavitation while ultrasonic cleaning produces random cavitation.
- Another distinction that you might want to note is that megasonic frequencies do not cause violent cavitation effects; ultrasonic frequencies do. Note as well that violent cavitation effects increase cavitation erosion and the likelihood of surface damage to the item being cleaned.
- Another difference is that megasonic cleaning system cleans only the side of the part that is facing the transducer; with ultrasonic cleaning, the cavitation occurs throughout the tank and all the sides of submerged areas.
While megasonic cleaning is used primarily my manufacturers of integrated circuits, flat panel displays, raw silicon suppliers, Ultrasonic cleaning is used in other objects such as jewelry, lenses and other optical parts, watches, dental and surgical instruments, and the like.
Facilities that facilitate megasonic and ultrasonic cleaning
Generally, companies that need these processes hire a third party service provider to do the tasks for them; others turn to wet process module manufacturers most especially those who are looking for processing tools that can be customized to suit their needs.
Megasonic versus Ultrasonic
The question you might have in mind right now is "how does megasonic cleaning differ from ultrasonic cleaning?" While these two processes are serving the same industries, they differ in a number of ways and here are some of the most important distinctions:
- They vary in terms of frequency used in generating acoustic waves; megasonic cleaning utilizes higher frequencies at 100kHz ; ultrasonic cleaning uses lower frequencies
- Another distinction is seen in cavitation; megasonic produces controlled cavitation while ultrasonic cleaning produces random cavitation.
- Another distinction that you might want to note is that megasonic frequencies do not cause violent cavitation effects; ultrasonic frequencies do. Note as well that violent cavitation effects increase cavitation erosion and the likelihood of surface damage to the item being cleaned.
- Another difference is that megasonic cleaning system cleans only the side of the part that is facing the transducer; with ultrasonic cleaning, the cavitation occurs throughout the tank and all the sides of submerged areas.
While megasonic cleaning is used primarily my manufacturers of integrated circuits, flat panel displays, raw silicon suppliers, Ultrasonic cleaning is used in other objects such as jewelry, lenses and other optical parts, watches, dental and surgical instruments, and the like.
Facilities that facilitate megasonic and ultrasonic cleaning
Generally, companies that need these processes hire a third party service provider to do the tasks for them; others turn to wet process module manufacturers most especially those who are looking for processing tools that can be customized to suit their needs.
About the Author:
Paul Drake writes an array of industry-related topics. He uses his prior experience working in hightech facilities in his writing tasks. To lean more about Megasonic Cleaning System and other topics such as al2o3 wet etch and pvdf tanks, visit Imtec Acculine official website.
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